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Wafer Back Grinding Process

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Wafer Back Grinding Process

Aug 25, 2021 Silicon wafer back grinding is generally divided into two steps: rough grinding and fine grinding. In the rough grinding stage, the diamond wheel with grit 46 # ~ 500 # , the axial feed speed is 100 ~ 500mm/min, and the grinding depth is generally 0.5 ~ 1mm. The aim is to quickly remove most of the excess material (90% of the processing

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